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Model ID: 481

Thermo-Mechanical Analysis of a Surface Mounted Resistor

The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime.

For surface-mounted resistors and other components producing heat, it is a well-known problem that temperature cycling can lead to cracks propagating through the solder joints, resulting in premature failure.

This multiphysics example models the heat transport, structural mechanical stresses and deformations resulting from the temperature distribution using the General Heat Transfer application mode and the Solid Stress-Strain application mode.

The plot shows the deformed shape of the resistor, and the isosurfaces of the temperature.

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