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Heat Transfer Module
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Cooling and Solidification
In this model, continuous casting processing of a metal rod from melted to solid state is modeled.
The model describes the fluid and solid flow and heat transport, including the phase transfer from melt to solid. This phase change causes momentum changes, latent heat release and a variation in ph...
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Absorbed Radiation (SAR value) in a Human Head
The increasing use of wireless equipment has also increased the amount of radiation energy to which human bodies are exposed. A common property that measures absorbed energy is the SAR value, (specific absorption rate) to determine the amount of radiation that human tissue absorbs.
The human head...
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Shell-and-Tube Heat Exchanger
In this model, you will study a part of a shell-and-tube heat exchanger, where hot water enters from above. The cooling medium flows through the tubes that, in this model, impose a constant temperature at the walls. Furthermore, the tubes are assumed to be made of stainless steel and the heat flux i...
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Free Convection in a Water Glass
This model treats the free convection and heat transfer of a glass of cold water heated to room temperature. Initially, the glass and the water are at 5 °C and are then put on a table in a room at 25 °C.
The nonisothermal flow is coupled to heat transfer using the Heat Transfer module.
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Thermo-Mechanical Analysis of a Surface Mounted Resistor
The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components.
An important aspect in electronics design and the choice of materials is a product’s durability and lifetime.
For surface-mounted resistors and other components prod...
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RF-Heated Hot Wall Furnace for Semiconductor Processing
Furnace reactors are used in the fabrication of semiconductor industry to grow layers on the wafers. These can also be used for epitaxial growth, which is a key technology for fabrication of electrical devices. For the wide band gap silicon carbide substance growth takes place in graphite susceptor...
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Convection Cooling of Memory Array Modules
In this example, we show the effects of poor design in an array of four memory chips cooled by a perpendicular cooling stream. Fluid flow is coupled to heat transfer in model. In this case, each memory module (or chip) forms an obstacle for the cooling of the ones positioned downstream in the flow.
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Forced Convection Cooling of Horizontal Circuit Board
In this suite of models, temperature distribution and fluid flow field is modeled with the General Heat Transfer and the Non-Isothermal Flow application modes. By modeling the fluid flow and heat transfer simultaneously the convective transfer is described very accurately. The results are analysed a...
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Temperature distribution in an IC package
Designs of circuit boards might have to consider the placements of surface-mount devices, which produce heat.
In this model, a heat producing voltage regulator, which reaches temperatures above 70 C is placed close to a surface mounted package with a sensitive silicon chip inside.
The heat produ...
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Nonisothermal Flow in a MEMS Heat Exchanger
This example concerns a stainless-steel MEMS heat exchanger, which you can find in lab-on-a-chip devices in biotechnology. Fluid flows through the tubes while a stainless steel heat sink/source surrounds the tubes.
The heat exchanger is modeled in 3D and accounts for heat transfer through both co...
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