MEMS Pressure Sensor Drift Due to Hygroscopic Swelling
Application ID: 30901
For their integration in microelectronic circuits, MEMS devices are bonded on printed circuit boards and connected with other devices. Then, the whole circuit is often covered with an epoxy mold compound (EMC) to protect the devices and their interconnects with the board. The epoxy polymers used for such applications are subject to moisture absorption and hygroscopic swelling, which can lead to delamination between the EMC and the board or to incorrect behavior of MEMS components.
The MEMS Pressure Sensor Drift app simulates the drift of the measured strain over time due to hygroscopic swelling on a MEMS pressure sensor subject to a moist environment. The app helps the designer to reach the required sensitivity and minimize the drift. This is done by specifying geometrical parameters, mold compound material properties, and external conditions.
The app was built utilizing the Transport of Diluted Species, Solid Mechanics, and Shell interfaces in the COMSOL Multiphysics® software.
This application example illustrates applications of this type that would nominally be built using the following products:MEMS Module Structural Mechanics Module
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.