# Application Gallery

The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.

Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. To download the MPH-files, log in or create a COMSOL Access account that is associated with a valid COMSOL license. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.

### Absorptive Muffler with Shells

This model describes the pressure wave propagation in a muffler for an internal combustion engine. The purpose of the model is to show how to analyze both inductive and resistive damping in pressure acoustics as well as coupling the fluid to the surrounding elastic shell structure of the muffler. Finally, the eigenmodes of a pure structural problem is analyzed and the modes compared to peaks ...

### MOSFET with Mobility Models

This model shows how to add several linked mobility models to the simple MOSFET example.

### Electromagnetic Force Calculation Using Virtual Work and Maxwell Stress Tensor

The model compare the electromagnetic force calculated by *virtual work* and *maxwell stress tensor* methods on the axial magntic bearing. The forces is evaluated by studying the effect of a small displacement on the electromagnetic energy of the system. This is done by using the *Magnetic Fields*, *Deformed Geometry* and *Sensitivity* physics interfaces.

### Thermal Fatigue of a Surface Mount Resistor

A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It responds nonlinearly to changes in both temperature and time. In order to ensure the structural integrity of the ...

### Designing a Waveguide Diplexer for the 5G Mobile Network

A diplexer is a device that combines or splits signals into two different frequency bands, widely used in mobile communication systems. This model simulates splitting properties using a simplified 2D geometry. The computed S-parameters and electric fields at the lower and upper bands will show the diplexer characteristics in the Ka-band.

### Time-to-Frequency Fast Fourier Transform of a Coaxial Low-Pass Filter

A very wide band coaxial low-pass filter is designed using a 2D axisymmetric model. To address the wide band frequency response with a fine frequency resolution, the model is built with a transient physics interface first. Then, S-parameters are calculated using a time-to-frequency Fourier transform. To achieve a low-pass frequency response, an air-filled coaxial cable is tuned with five ...

### Transmission Line Butler Matrix Beamforming Network

A Butler matrix is a passive beamforming feed network. It is a cost-effective feed network for phased array antennas because the circuit can be fabricated in the form of microstrip lines and is a viable solution for performing beam scanning without deploying expensive active devices. This example shows how to design such a circuit using the *Transmission Line* interface. The results show the ...

### Car Windshield Antenna Effect on a Cable Harness

Modern cars have rear-windshield FM antennas to play FM radio. The radiation emitted from an antenna induces an electric current on the outer surface of any cable harnesses in the car, which can have negative effects. This model uses the RF Module to compute the far-field radiation pattern of the antenna, by enclosing the car in perfectly matched layers separated by an air domain. The electric ...

### MEMS Pressure Sensor Drift Due to Hygroscopic Swelling

For their integration in microelectronic circuits, MEMS devices are bonded on printed circuit boards and connected with other devices. Then, the whole circuit is often covered with an epoxy mold compound (EMC) to protect the devices and their interconnects with the board. The epoxy polymers used for such applications are subject to moisture absorption and hygroscopic swelling, which can lead to ...

### Sub-Component Lumping in Acoustics Using the Impedance Boundary Condition

This application illustrates a modeling approach for deriving physically consistent simplified models in the Acoustics Module. The approach consists of converting complex sub-components to an impedance boundary condition and otherwise using simple acoustics throughout the COMSOL model. As a consequence, significant computational speed-up can be achieved. The example treated here consists of a ...

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