Multi-Domain Analysis of Silicon Structures for MEMS Based-SensorsN. Bhalla, S. Li, and D. Chung
Chung Yuan Christian University, Chungli,Taiwan
National Tsing Hua University, Hsinchu, Taiwan
Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.
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