Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Advanced Application of an Automated Generative Tool for MEMS Based on COMSOL Multiphysics

F. Bolognini
University of Cambridge
Cambridge, UK

This work presents a different use of COMSOL as an integrated component of a computational tool framework used to automate designs creation. CNS-Burst is a computational synthesis method that has been implemented with the aim of automatically generating solutions to an assigned design task. COMSOL is integrated in the method and used to evaluate the performance of the design solutions found. ...

An Improved Model for High Temperature Inductive Heating

S. A. Halvorsen, and N. Kleinknecht
Teknova AS
Kristiansand, Norway

An axially symmetric multiphysics model for industrial induction furnaces has successfully been converted from COMSOL Multiphysics version 3.5a to version 4.2. The model combines computation of magnetic fields, heat transfer and thermal stresses. The inner part of the furnace is described by a few discrete state variables. While the current in the induction coil is input in COMSOL, the model ...

Impulsive Thermomechanics of hypersonic surface phononic crystals

F. Banfi[1], D. Nardi[2], and M. Travagliati[3]
[1]Dipartimento Matematica e Fisica, Università Cattolica, Brescia, Italy
[2]JILA, University of Colorado at Boulder, Boulder, Colorado, United States
[3]Center for Nanotechnology Innovation @NEST, Istituto Italiano di Tecnologia, Pisa, Italy

Ultrafast optical generation of pseudosurface acoustic waves is investigated in hypersonic surface phononic crystals. The thermomechanics is modeled from first-principles to follow the initial impulsive heat-driven displacement in the time domain. Spectral decomposition of the displacement over the surface phononic crystal eigenmodes outlines asymmetric resonances featuring the coupling between ...

Modelling Failure Mechanims in Sands Under Extreme Loads Using COMSOL

J. Mwebesa, D. Kalumba, and R. Kulabako
Makerere University
Kampala, Uganda

Studies by Nishaat (2009) showed that Terzaghi\'s bearing capacity model didn\'t adequately predict the bearing capacity failure in Philippi Dune sands. Nishaat carried out her investigation using a physical model that was built in a geotechnical laboratory. The failure surfaces she observed in the sands did not resemble those predicted by Terzaghi and Meyerhof\'s models. However the use of a ...

Numerical Study of the Effect of Fins on the Natural Convection Driven Melting of Phase Change Material

C. Liu, and D. Groulx
Mechanical Engineering
Dalhousie University
Halifax, NS
Canada

Natural convection has to be accounted and simulated for in order to properly describe the physics encounter in the phase change process. A simplified two-dimensional model was created in COMSOL 4.1. Natural convection was accounted for by adding a volume force and using the Boussinesq approach. The heat transfer and laminar flow physics were used. Results showed that natural convection played ...

Modeling of the Heat Transfer Between a CO2 Sequestration Well and the Surrounding Geological Formation

B. Sponagle[1], M. Amadu[2], D. Groulx[1], and M. Pegg[2]
[1]Mechanical Engineering, Dalhousie University, Halifax, NS, Canada
[2]Process Engineering and Applied Science, Dalhousie University, Halifax, NS, Canada

In a carbon sequestration system CO2 would be pumped down a well and into a reservoir at supercritical temperatures and pressures. An important consideration is the long term stability of the reservoir. The goal of these simulations is to thermally model the injection well and investigate the temperature gradient developed in the cap rock. Ultimately, results from this study will lead to an ...

Finite Element Analysis of Integrated Circuit Interconnect Lines on Lossy Silicon Substrate

S. Musa[1], M. Sadiku[1], and A. Emam[2]

[1]Roy G. Perry College of Engineering, Prairie View A&M University, Prairie View, TX
[2]Information Systems Department, King Saud University, Riyadh, Saudi Arabia

The silicon substrate has a significant effect on the inductance parameter of a lossy interconnect line on an integrated circuit. It is essential to take this into account in determining the transmission line electrical parameters. In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated using the finite element ...

Shape Optimization of Electric and Magnetic System using Level Set Technique and Sensitivity Analysis

Y. Sun Kim, A. Weddemann, J. Jadidian, S. Khushrushahi, and M. Zahn
Dept. of Electrical Engineering and Computer Science
MIT
Cambridge, MA

The classical optimization method has been applied to many design problems for electromagnetic systems. One of its major difficulties is related to meshing problems arising from shape modifications. In order to circumvent these kinds of technical difficulties with moving mesh problems, several researches have tried to formulate shape optimization with fixed mesh analyses based on fixed grid ...

A 2D Axisymmetric Electrodeposition Model

R. Pryor
Pryor Knowledge Systems, Inc.
Bloomfield Hills, MI

Electroplating is a vital technology widely employed for many technological applications ranging from decorative or anti-corrosion coatings to high precision nanotechnology passive electromagnetic cloaking devices. This 2D Axisymmetric Electroplating Model demonstrates one of the modeling methodologies that can be used to calculate the transient generation of a coating thickness of a deposited ...

Optimization of a High-Temperature High-Pressure Direct Wafer Bonding Process for III-V Semiconductors

R. Martin, J. Kozak, K. Anglin, and W. Goodhue
University of Massachusetts Lowell
Lowell, MA

Many optoelectronic devices utilize a heterojunction of a pair semiconducting materials including high-efficiency MEMS devices, solar cells, LEDs, and VCSELs. One fabrication technique which achieves such a device is direct wafer fusion. To optimize the process, COMSOL Multiphysics 4.0 was used to test various geometric configurations of the fixture. 2D and 3D models were created in order ...

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