Preconditioning (PRE) of Surface Mount Devices (SMDs) for testing
Application ID: 120921
Prior to the reliability testing, surface mound devices (SMDs) are required to go through a preconditioning process, which represents the effects of storage and the typical reflow operation in the following board assembly process. During the preconditioning process, test samples usually are subjected to temperature cycling, dry bake, moisture soaking and solder flow operations. This model analyzed the thermal stress of the SMD as well as the hydroscopic swelling in the plastic seal to evaluate the structure deformation and damage of the SMD.
The test method is based on the Standard JESD22-A113I (https://www.jedec.org/node/8493)
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.