Thermal Initial Stresses in a Layered Plate

Application ID: 273


The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer, is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced due to the difference in coefficients of thermal expansion. A third layer, the carrier layer, is then introduced in a stress-free state. Finally, the temperature is reduced to 20 degrees C, and as a result, there are thermal stresses in all layers.

This model example illustrates applications of this type that would nominally be built using the following products:

MEMS Module Structural Mechanics Module